The 4860P Sn63Pb37 No Clean Solder Paste is made from a blend of high purity, non-recycled tin and lead alloy powder blended with a no clean flux to form a paste.
The No-Clean Solder Paste by MG Chemicals is designed for surface mount applications and provides high tack force and good wettability. The post soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. No clean means that residues are not harmful to assemblies.
Applications & Usages
The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when using an ultra-fine pitch stencils down to 0.3 mm.
Features
Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
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