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Thermal Conductive Epoxy, Slow Cure image Zoom

Thermal Conductive Epoxy, Slow Cure

SKU: 8329TCS-6ML
The 8329TCS Slow Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines long working time and high conductivity with ease of use.

Availability: In stock

$14.95

SKU:8329TCS-6ML

Product Description

    Details

    The 8329TCS Slow Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines long working time and high conductivity with ease of use. It has a convenient 1-to-1 mix ratio and 4 hours pot life. Due to this long pot life, the mixed adhesive essentially behaves like a 1-part adhesive for the duration of a work shift. However, unlike 1-part adhesives, it doesnt require temperatures as high as 130 and 170 C, and it will cure at a more moderate 80 C in less than 1 hour. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.


    • Good low temperature alternative to 1-part TC adhesives with inconveniently high cure temperature
    • Excellent 1.44 W/(m"K) thermal conductivity
    • Easy 1:1 mix ratio
    • Adheres to most electronic substrates
    • Stores and ships at slightly below room temperature  no freezing or dry ice required
    • Very long shelf life of at least three years  even when stored at room temperature
    • Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons


    Applications
    The 8329TCS is used for thermal management situations requiring superior bonding strengths and good thermal transfers.
    For example, it is used to as a die-attach for electrical and electronics, increasing their long term reliability.
    It is great for heat sink bonding.
    It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat.

    Application Instructions

    Follow the procedure below for best results. For mixing quantities that are less than 1 mL in size or for stricter stoichiometry control, mix by weight ratio instead (requires a high precision balance). Heat cure is recommended to get the best possible conductivity.

    To prepare 1:1 (A:B) mixture

    1. Remove cap or cover.
    2. Measure one part by volume of A.
    3. Measure one part by volume of B.
    4. Thoroughly mix the parts together with a stir stick until homogeneous.
    5. Apply with an appropriate sized stick for the application area.

    DATA SHEET

Additional Information

    Additional Information

    SKU 8329TCS-6ML
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